Alliance between Intel and Arm to develop SoCs with the 18A node

Intel Foundry Services and arms have reached a multigenerational agreement for the design and manufacture of new processors for smartphones based on computer system chips (SoCs). For this, the technology of Intel’s 18A low power manufacturing process applied both in Europe and the United States.

Cutting-edge Intel 18A process technology brings a number of efficient aspects such as power and performance improvements, as well as a strong manufacturing footprint. Arm’s CEO, Rene Haassees this merger as a step forward, as its secure and energy-efficient processors are found in billions of devices around the world.

Although the goal is to develop processors for smartphones, the agreement between Intel and Arm it also encompasses automotive, Internet of Things (IoT), data center, aerospace and government applications. Similarly, responding to emerging demand for digitization Yet the need for energy efficiency so big that currently exists, thus expanding market opportunities.

The chips with 18A GAA (Gate All Around) node that Intel will deliver to Arm seals a new alliance, followed by the agreements that the company already has with other companies such as Qualcomm and MediaTek. In addition, in this way it will manage to reduce the monopoly power of the Taiwanese multinational TSMC in the semiconductor sector, as well as Samsung in the field of mobile telephony.

The project is still in the development phase and the Intel18A node is not expected to be available until the last quarter of 2025although there are other theories that point to 2026 and even 2027. However, time plays against Intel and Arm, because if the launch were to last too long, TSMC and Samsung would already be working with the 2nm node.

Already at the beginning of last March, the president of the Intel subsidiary in China, wang ruiassured that its engineers had completed the development of its 2 and 1.8 nm integration technologieswhich means that its technicians have finished fine-tuning the materials they will use to produce integrated circuits from two lithographic nodes.

The improvements that include

The collaboration between Intel and Arm will allow the construction of a more balanced global supply chain for customers working on mobile SoC design on Arm-based CPU cores. The merger will also boost the design technology optimization (DTCO) in which chip configuration and process technologies are optimized to improve power, area, and cost (PPAC) for Intel 18A process technology Arm cores.

In another order, Intel 18A presents two innovative technologies: PowerViawhich allows optimal power delivery, and RibbonFET crawls around (GAA)a transistor architecture for more optimal performance and power.

Arm’s contribution

Much has been made of the power of the Intel 18A, but Arm introduces technology that defines the future of computing. With more than 1,000 technology partners and the ability to develop a advanced computing on more than 250 billion chipsthe company has incorporated artificial intelligence and cybersecurity into all its services to consolidate the future of the digital world.

A new opportunity

If the project goes well, other manufacturers could use and repurpose them with the help of Intel’s packaging, software, silicon and chiplet technologies. And it is that any company without a factory to an efficient CPU IP and an excellent open system foundry with cutting-edge technology will see here an unprecedented opportunity.

Own Pat Gelsinger, CEO of Intel, ensures that this type of customer will now have more options to design the most advanced mobile technology. The alliance between both business networks, and this is an idea shared by René Haas, will allow them to produce the new wave of innovative products on the market

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