The Intel 3 node, formerly known as the 5nm node of the chip giant, represents one of the most important advances of the company in terms of semiconductor manufacturing, and it is also one of the most complicated leaps that the Santa Clara giant has had to face so far.
First of all I want to explain to you why the Intel 3 node is identified with that number and not with 5. It is a very easy topic to understand, and it is that although it is true that a 5 nm manufacturing process is used, the density of transistors that Intel reaches is so high that It outperforms TSMC’s 3nm node in transistor density.
It goes without saying that integrating a higher density of transistors not only increases the complexity of the design of a specific chip, but also increases the chances of defects arising, and with this, its viability at the wafer level becomes more difficult and increase costs. Therefore, when we talk about semiconductor manufacturing It’s not just the node that matters, transistor density is also key.
As confirmed by the chip giant, the development of the Intel 3 node is progressing as planned. In the second quarter of this year they achieved their goal in terms of density and performance, and for now they are on the right track to be able to achieve your performance and success rate goals per wafer.
This means that, unless a problem occurs, this manufacturing process will be ready to enter the mass production phase just in time to bring your next generation of processors to lifewhose release is scheduled for next year.
The Intel 3 node is expected to achieve an 18% performance-per-watt improvement over the Intel Node 4 which, I remind you, is still a 7nm node despite what its name indicates, although in this case it is an improved version. We know that Intel Granite Rapids will use this new node, theoretically arriving sometime in 2024.
