There is no doubt that NAND Flash memory is becoming the storage of the future. And it is that non-volatile RAM not only brings with it not having the access problems of disk drives, but also higher transfer speeds. Micron just announced memory 232-layer 3D NAND and Western Digital is not far behind either. Let’s look at the future of NVMe SSDs.
There are many types of flash memory on the market and with different uses and interfaces. But for some time now we have seen a common evolution: the use of 3D NAND memory. Which consists of stacking flash memory chips vertically and using pathways through silicon to communicate with them. This allows them to increase the capacity of these without having to use complex and expensive advanced manufacturing nodes.
This is important, due to the fact that if there is a point where this type of storage falters, it is in the price of storage, much higher than a conventional hard drive. So it is the main motivation of manufacturers today when we talk about non-volatile memory chips. Which is the type of memory used in the NVMe SSDs that all laptops already mount as standard.
Micron introduces its 232-layer 3D NAND memory
Yes, that time of the year has arrived and after a long wait a manufacturer has already exceeded 200 layers in its flash memory. We are referring to the Micron 232 Layer 3D NAND. Of course, we must clarify that we are not talking about a complete NVMe SSD, but only about one of its components. Let’s not forget that these storage units bring with them the chips to store data, the flash controller and in many cases RAM memory for the controller.
well, dand what we are talking about is the storage chips. And it is that Micron has managed to place 128 GB of storage on a single chip made up of 232 layers. The type of memory cell used? FTA, so we could also see chips with QLC cells in the future. All this is an improvement not only in the storage of future NVMe SSDs for PCs and consoles, but also a decreased consumption, at least in storage. Something that is necessary due to the fact that with the future adoption of the PCI Express interface, the consumption in the transfer will increase.
However, we do not know at the moment what the improvements in data access speed are in the 232-layer 3D NAND, information that the South Korean manufacturer has kept to itself at the moment. In any case, we will have to wait well into 2023 to see the first solid-state drives and laptops with this technology. The reason? It has just been presented, but has not yet been put into production.
Western Digital is not far behind either
Not only has Micron introduced flash memory with over 200 layers, but WesternDigital has also presented a similar solution. However, they have given the opposite information for their new 3D NAND over 200 layersyes Since we completely do not know the number of these. From what we have been able to know that the vtransfer speed has increased by 60% and the write speed 15%.
This is a preview of the next generation of storage based on persistent memory chips. And we are very clear that they will not be the first manufacturers to announce their solutions in the coming months or weeks.