Qualcomm has brought its main novelties to the Mobile World Congress in chips and connectivity, and among them is a 5G modem which incorporates what the company claims is the first 5G processor with Artificial Intelligenceand also him first chip with WiFi 7 connectivity. In addition, it has also introduced innovations related to Snapdragon 5G RF modem systems and 5G RAN platforms.
Snapdragon X70 5G, Qualcomm’s first modem with an AI processor
Qualcomm has announced that its 5G modem Snapdragon X70 It is the first to integrate a chip equipped with Artificial Intelligence. It is designed to be more stable and have a higher level of energy efficiency than other Qualcomm modem models, which is enabled by AI. It also uses a machine learning algorithm to improve performance.
The Snapdragon X70 is designed to better manage wave emissions, which will allow it to establish a stronger link when using the available spectrum, even if there are some problems. In addition, it employs the processor for network selection and antenna tuning, leading to better coverage and a stronger link. In this way, according to Qualcomm, the X70 is capable of making the most of the available signal at all times. In theory, the modem is capable of a download speed of up to 10 Gbps.
Qualcomm expects to start offering the first units of the Snapdragon X70 to smartphone manufacturers during the second half of 2022, so that the first phones that integrate it will be on the market before the end of this year. Once it is available, the devices that integrate it will bear the company’s new seal: Snapdragon Connect.
FastConnect 7800, a platform with WiFi 7 connectivity
Qualcomm has also shown its commitment to WiFi 7 technology with the announcement of the FastConnect 7800 platform, with chips with WiFi 7 connectivity, peak speeds of up to 5.8 Gbps and next-generation Dual Bluetooth capabilities. It is the first WiFi 7-ready chip that will hit the market, if all goes well, in the second half of 2022. Of course, it is possible that most devices will not be compatible with this new wireless communication protocol until 2024 .
The chip carries multi-link Simultaneous Broadband (HBS) technology, in addition to promising 50% lower power consumption than current models. In addition, with it, several 5GHz and 6GHz connections can be established with remarkable stability, and also with the lowest possible latency. At the same time, the chip reserves the 2.4 GHz spectrum for Bluetooth and lower-band Wi-Fi. It also features Smart Dual Bluetooth and Snapdragon Sound technologies.
The latter, integrated with Dual Bluetooth, offers Bluetooth LE Audio and Bluetooth 5.3 with Intelligent Dual Bluetooth of last generation and audio quality of 16 bit Bluetooth CD, 44,100 Khz, and 96 Khz of 24 bits. In addition, Snapdragon Sound will support voice in super wideband with 32 Khz, in order to achieve calls with total clarity. These improvements will be offered by two radios to double the range, and also to allow the synchronization of several devices at the same time. Reducing synchronization time allows users of Qualcomm FastConnect 7800 devices to switch their connections from a smartphone to a PC or car instantly.
In fair, Qualcomm hopes that this platform will allow you to achieve an audio latency of 68 milliseconds, to get to play without delay. Also have a voice channel for chat within the game in augmented and mixed reality headsets. These improvements in speed and sound quality will use Audio LE for audio sharing and streaming, among other improvements that streamers will certainly appreciate.
